Manual 75ml adhesive syringe gun for controlled bonding agent application.
Aerosol spray cleaner that removes flux residue from soldered electronic components.
Twenty millilitre plastic syringe barrel for precise adhesive and sealant application.
Liquid de-icer spray for clearing ice and frost from equipment and surfaces.
Clear 10ml plastic syringe for adhesive and chemical dispensing.
White epoxy adhesive for industrial bonding, rated from -40°C to +130°C.
Silicone thermal pad for flexible electronics heat management.
Silicone-based thermal conductive pad for electronics heat management.
Thermally conductive adhesive for permanently bonding electronic components while transferring heat.
Flux remover spray for cleaning printed circuit boards and electronic components.
Silicone thermal adhesive manages heat in electronics and machinery.
Long-length desoldering braid for bulk solder removal in high-volume electronics repair.
Industrial-grade silicone thermal grease for efficient heat transfer in electronics and cooling systems.
Black polyurethane liquid resin for sealing and bonding in wide temperature range.
Thermal paste adhesive for bonding metal components in heat management applications.
Standard silicone thermal grease for general electronic device cooling needs.
Liquid sealant remover for stripping and removing cured sealant materials.
Black polyurethane resin provides flexible bonding for electronics and mechanical parts.
Black two-part polyurethane resin for adhesive and potting applications.
Fast-setting instant glue for metal, plastic, wood and glass assembly work.
Low-viscosity polyurethane resin for bonding and sealing industrial components.
Black flame-retardant epoxy potting compound for electronics with thermal conductivity.
Lead-free peelable solder mask for protecting circuit board areas.
Non-silicone thermal grease operating from -50°C to +130°C for component cooling.
Clear polyurethane resin for flexible bonding and encapsulation applications.
Non-silicone thermal grease for compact electronics cooling applications.
Non-silicone thermal grease for electronics cooling and heat transfer applications.
Black PUR potting compound with oxidation resistance for electronics protection.
Non-silicone thermal grease for heat transfer in electronics assembly.
Black epoxy potting compound with water resistance for electronics and thermal applications.
Fine 1.25mm desoldering braid for precise solder joint removal.
Epoxy resin bonds and protects printed circuit boards at temperatures up to one eighty.
Polyurethane potting compound for electronics, flame-resistant and heat-conducting.
Black polyurethane potting compound with thermal conductivity for electronics protection.
Clear epoxy resin adhesive with high temperature tolerance for industrial assembly.
Blue reenterable PUR potting compound for thermal management in electronics.
White epoxy potting compound with water resistance for electrical equipment protection.
Aerosol flux remover spray for cleaning circuit boards after soldering.
Black flame-retardant epoxy with high thermal conductivity bonds and potts electronics.
Pre-saturated isopropyl alcohol wipes for general cleaning of electronics and surfaces.