Epoxy conductivity sensor probe measuring water conductivity from microsiemens to millisiemens range.
Black epoxy adhesive resin with high thermal conductivity for electronics potting.
Black epoxy potting compound with thermal conductivity for electronics encapsulation.
High-performance black epoxy potting compound for electronics and heat management applications.
Black thermal epoxy resin for electronics repair and component bonding.
Silver conductive epoxy gel for electronics, EMI shielding and conductive bonding.
Black flame-retardant epoxy with high thermal conductivity bonds and potts electronics.
Blue epoxy adhesive with thermal conductivity for electrical component bonding.
Blue epoxy resin adhesive with low viscosity for electronics and industrial bonding.
Blue epoxy potting compound for thermal protection in electronics and industrial equipment assembly.
Silver conductive epoxy gel enables soldering without heat, shields electronics.
Silver conductive epoxy gel for electrical connections, shielding, and cold soldering.
Silver conductive epoxy gel for electronics assembly, shielding, and cold soldering.
Heat-conductive black epoxy for encasing electrical components and electronics.
Small epoxy resin adhesive in syringe for bonding and coating electrical components.
Black epoxy for bonding and potting electronic components with thermal management.
Black flame-retardant epoxy potting compound for electronics up to 120°C.
Conductivity sensor probe for measuring dissolved solids and salt content in water.
Conductivity sensor probe measures water electrical conductivity and salinity.
Black flame-retardant epoxy potting compound for electronics with thermal conductivity.
Conductive epoxy adhesive for electronics thermal management and metal bonding.
Black epoxy resin adhesive in syringe for bonding and potting applications.
Digital conductivity meter for water quality testing, range 0 to 20 mS/cm.
Black epoxy adhesive for bonding and potting electronic assemblies with moderate heat tolerance.
Translucent epoxy resin adhesive in bulk for industrial bonding and potting.
Industrial conductivity meter withprobe, operates to 200°C, measures 1 µS/cm to 1 mS/cm.
Quick-setting epoxy paste for fast bonding across multiple material types.
Black low-viscosity epoxy adhesive for structural component potting and bonding.
Black epoxy resin adhesive for electrical component potting and bonding applications.
Translucent epoxy resin adhesive for potting and bonding electronics components.
Black epoxy resin in large can for potting electronics and thermal protection.
Conductive epoxy adhesive for electronic component bonding and thermal heat transfer.
Portable conductivity meter for water quality testing in field or lab environments.
Silver epoxy adhesive for electrical bonding of ceramics, glass, metals, plastics.
Clear epoxy resin adhesive in dual cartridge for general industrial bonding.
Black flexible epoxy compound for potting and protecting electronic components safely.
Handheld epoxy gun for dispensing large quantities of two-part adhesive.
Yellow epoxy adhesive for bonding ceramic, metal, plastic and wood.
Two-part epoxy paste bonds metal, glass, ceramic and wood in five minutes.
High-temperature black epoxy for electronic potting and bonding in extreme heat applications.