| Adhesive Type | Conductive Epoxy Adhesive |
| Trade Name | Cold Solder |
| Application | Thermal Management |
| Material Compatibility | Metal, Plastic |
| Product Form | Solid |
| Package Type | Syringe |
| Package Size | 21 g |
| Cure Time | 1 h |
| Viscosity Description | High Viscosity |
| Maximum Operating Temperature | +150°C |
| Specific Gravity | 3.56 |
| Minimum Operating Temperature | -40°C |
| Operating Temperature Range | -40 → +150 °C |
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