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RS PRO
RS PRO Black Epoxy Potting Compound 50 ml
Part: 851-044
Black epoxy potting compound for protecting and sealing electronic components and circuits.
Product Material
Epoxy
Package Type
Dual Cartridge
Package Size
50 ml
MG Chemicals
MG Chemicals 832HD-50ML Epoxy Potting Compound 50 mL
Part: 832HD-50ML
Two-part epoxy for protecting electronic circuits from moisture and chemicals.
Epoxy
Dual Cartridge
50 ml
MG Chemical
MG Chemical 8329 TFS Liquid Thermal Adhesive, 25 ml
Part: 8329TFS-25ML
Thermal adhesive for heat-sensitive electronics and component bonding applications.
Thermal Adhesive
8329 TFS
Thermal Management
Loctite
Loctite Hysol 9455 Liquid Adhesive, 50 ml
Part: 451277
Thermal epoxy adhesive for bonding ceramics, metal, plastic, and rubber components.
Epoxy Adhesive
Hysol 9455
Thermal Management
ITW Devcon
ITW Devcon Devweld 530 Paste Adhesive, 50 ml
Part: 20500
Fast-setting paste adhesive for bonding composite, metal and plastic components.
Acrylic Adhesive
Devweld 530
Bonding
MG Chemical
MG Chemical 8329 TFF Liquid Thermal Adhesive, 50 ml
Part: 8329TFF-50ML
Thermal management adhesive for bonding heat-sensitive electronic components securely.
Thermal Adhesive
8329 TFF
Thermal Management
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