"module component" — 6 Results

You searched for "module component"

6 products found · 1 categories · Top brands: MG Chemicals· MG Chemical· RS PRO· Fischer Elektronik

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MG Chemical

Part: 832WC-3L

Transparent epoxy potting compound for electronics encapsulation and protection.

Product Material Epoxy Package Type Can Package Size 3 L

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MG Chemicals

MG Chemicals 832C-375ML Translucent Epoxy Epoxy Resin Adhesive 375 ml

Part: 832C-375ML

Translucent epoxy resin adhesive for potting and bonding electronics components.

Epoxy Can 375 ml

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Fischer Elektronik

Fischer Elektronik WLK10 Thermal Adhesive, 1 + 10 g

Part: WLK10

Thermal epoxy adhesive for bonding metal and plastic components in electronics.

Thermal Adhesive WLK10 Thermal Management

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MG Chemicals

MG Chemicals 832TC-450ML Black Epoxy Epoxy Resin Adhesive 450 ml

Part: 832TC-450ML

Black thermal epoxy resin for electronics repair and component bonding.

Epoxy Can 450 ml

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MG Chemicals

MG Chemicals 8329 TCS Liquid Thermal Adhesive, 50 ml

Part: 8329TCS-50ML

Heat-conductive liquid adhesive for bonding electronics and industrial components.

Conductive Adhesive 8329 TCS Industrial, Thermal Management

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RS PRO

RS PRO Flux Remover

Part: 241-2449

Industrial aqueous flux remover for cleaning solder residue from electronic components and PCBs.

25 L Can Aqueous

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