Quick-setting epoxy paste for fast bonding across multiple material types.
Silver epoxy paste adhesive in 5ml for ceramic, metal, plastic and rubber bonding.
Red epoxy paste adhesive designed for bonding circuit boards and electronics.
Heavy-duty epoxy paste for sealing and repairing concrete, stone and wood floors.
Yellow epoxy paste adhesive for bonding polyamide and industrial materials.
Clear epoxy resin adhesive in dual cartridge for general industrial bonding.
Epoxy paste adhesive for plastic bonding and general purpose joining and repair.
Blue epoxy paste for metal bonding with high temperature resistance to 177°C.
Two-ton transparent epoxy paste adhesive in 50ml cartridge for general bonding.
Yellow epoxy paste for bonding polyamide materials with 36-hour cure time.
Two-part epoxy paste bonds metal, glass, ceramic and wood in five minutes.
Thixotropic epoxy resin paste in tin for structural bonding and assembly.
Large 2kg yellow epoxy paste for industrial bonding and repairs.
High-performance black epoxy potting compound for electronics and heat management applications.
Black epoxy resin adhesive in syringe for bonding and potting applications.
Blue epoxy resin adhesive with low viscosity for electronics and industrial bonding.
Two-part epoxy paste adhesive for bonding metal, wood, ceramic, and concrete surfaces.
Black epoxy adhesive resin with high thermal conductivity for electronics potting.
Black epoxy adhesive for bonding and potting electronic assemblies with moderate heat tolerance.
Black thermal epoxy resin for electronics repair and component bonding.
Translucent epoxy resin adhesive in bulk for industrial bonding and potting.
Black epoxy potting compound with thermal conductivity for electronics encapsulation.
Tin-lead-silver solder paste for manual circuit board assembly.
Grey epoxy paste adhesive with excellent shear strength for industrial bonding.
Small epoxy resin adhesive in syringe for bonding and coating electrical components.
Black flame-retardant epoxy with high thermal conductivity bonds and potts electronics.
Black low-viscosity epoxy adhesive for structural component potting and bonding.
Black epoxy resin adhesive for electrical component potting and bonding applications.
Translucent epoxy resin adhesive for potting and bonding electronics components.
Black epoxy for bonding and potting electronic components with thermal management.
Solder paste in larger syringe for surface mount electronics manufacturing and assembly.
Standard rosin flux solder paste in syringe for surface mount electronics work.
Black epoxy resin in large can for potting electronics and thermal protection.
Solder paste in syringe for standard SMD and manual assembly.
Blue epoxy adhesive with thermal conductivity for electrical component bonding.
Lead-based solder paste in syringe for component placement and assembly.
Lead-based solder paste in syringe for SMD and manual assembly work.
Ready-to-use solder paste in syringe for automated and manual electronics component assembly.
Lead-free solder paste in syringe for surface mount electronics assembly.
Lead-free solder paste in jar format for surface-mount device assembly.