Black aluminium heatsink dissipates heat from electronic components and semiconductors.
Square aluminum heatsink for general semiconductor cooling applications.
Universal square aluminium heatsink for flat-surfaced semiconductor devices.
Compact aluminium heatsink for cooling semiconductor devices and electronics components.
Universal square aluminium heatsink for semiconductors and electronic components.
Small universal square aluminium heatsink for semiconductor devices.
Small square aluminum heatsink suitable for semiconductors and flat-surface power devices.
Square aluminum universal heatsink for electronic processor and component cooling.
Aluminum heatsink for cooling electronic components in industrial equipment.
Universal square aluminum heatsink for general industrial electronic cooling.
Large square aluminium heatsink for heavy-duty cooling in industrial power applications.
Large aluminum heatsink for cooling industrial electronic equipment and power systems.
Large industrial-grade aluminum heatsink for high-power thermal dissipation.
Compact square heatsink for PGA microprocessor package thermal cooling.
Compact aluminium heatsink for dissipating heat from electronic components and processors.
Small adhesive-mounted aluminum heatsink for BGA and IC packages.
Small aluminium heatsink with adhesive backing for cooling IC chips and small electronics.
High-performance anodized aluminum square heatsink for PCB mounting.
100x100mm aluminum heatsink for PCB-mounted high-power semiconductor cooling.
Adhesive-mount square aluminum heatsink for BGA and surface-mount integrated circuits.
Adhesive-mounted square heatsink for BGA microchip thermal control.
Large square aluminum heatsink for high-power semiconductor and optoelectronic devices.
Tiny adhesive-mounted heatsink for ball grid array integrated circuits.
Large square heatsink for LED arrays and high-power electronic component cooling.
Square aluminium clip-mounted heatsink for BGA package cooling.
Aluminum heatsink for PGA chip packages with adhesive mounting.
Aluminium square heatsink with conductive foil for BGA component cooling.
Square aluminium heatsink with adhesive foil mounting for IC thermal management.
Adhesive-mounted aluminum heatsink for integrated circuits and BGA packages.
Ultra-small aluminum heatsink for BGA microchips with adhesive mounting.
Small square aluminium heatsink with adhesive foil for compact electronic component cooling.
Large square anodized aluminium heatsink for high-power industrial electronic cooling.
Small adhesive-mounted aluminum heatsink for BGA chip cooling.
Universal square aluminum heatsink with low thermal resistance for high-performance electronics.