Transparent gel potting compound in pack for thermal electrical applications.

Black two-part polyurethane resin for adhesive and potting applications.

Dual-color epoxy resin adhesive for bonding and thermal applications.

Small pack black epoxy potting compound for electronics encapsulation.

Transparent gel potting compound for electronics protection in compact size.

Blue reenterable PUR potting compound for thermal management in electronics.

Black PUR potting compound with oxidation resistance for electronics protection.

Low-viscosity polyurethane resin for bonding and sealing industrial components.

Black polyurethane liquid resin for sealing and bonding in wide temperature range.

Black polyurethane resin provides flexible bonding for electronics and mechanical parts.

Clear polyurethane resin for flexible bonding and encapsulation applications.

Black polyurethane potting compound with thermal conductivity for electronics protection.

Transparent gel potting compound for protecting and encapsulating electronic devices.