Small universal aluminum heatsink for DIL-IC and integrated circuit packages.
Small square aluminum heatsink for semiconductor device heat dissipation.
Ceramic square heatsink with pin fin design for universal IC cooling.
Ceramic heatsink for cooling electronic chips and power modules in industrial equipment.
Tiny aluminum heatsink for DIL-IC integrated circuits in compact applications.
Very small heatsink for DIL integrated circuits and micro-components cooling.
Tiny surface-mount aluminum heatsink for integrated circuits.
Small adhesive heatsink for cooling semiconductor devices and BGA components.
Adhesive-mount square aluminum heatsink for BGA and surface-mount integrated circuits.
Adhesive-mounted aluminum heatsink for cooling BGA chip packages in electronics.
Aluminum heatsink for BGA chip packages with conductive adhesive.
Small square aluminium heatsink for BGA packages with conductive adhesive mounting.
Ceramic square heatsink for high-voltage electronics and LED cooling applications.
White ceramic heatsink for LEDs, chips and power modules with adhesive and screw mounting.
Large ceramic square heatsink for high-voltage electronics and power cooling.
White ceramic square heatsink for LEDs and power modules with pin-fin design.
Ceramic heatsink for non-conductive cooling of sensitive electronic components.
Small ceramic heatsink for compact high-voltage chip and LED cooling.
Small ceramic pin-fin heatsink for LED and chipset cooling.
Ceramic pin-fin heatsink for compact electronics cooling with adhesive or screw mounting options.
White ceramic heatsink for cooling LEDs and power modules with high breakdown voltage.