Small universal square aluminium heatsink for semiconductor devices.
Tool steel bar for making cutting tools, dies, and precision hardened machine components.
Adhesive-mount aluminum heatsink for BGA and semiconductor devices.
Tiny adhesive-mounted aluminum heatsink for small chip cooling.
Adhesive-backed compact heatsink for direct mounting on BGA semiconductor devices.
Small adhesive-backed aluminium heatsink for semiconductor thermal management.
Adhesive-mounted round heatsink for compact electronic component cooling.
Adhesive-mounted square heatsink for BGA microchip thermal control.
Small adhesive-mounted aluminum heatsink for BGA chip cooling.
Adhesive-mounted square aluminium heatsink for BGA processors and chips.
Small square aluminium heatsink with adhesive foil for compact electronic component cooling.
Ultra-small aluminum heatsink for BGA microchips with adhesive mounting.
Tiny adhesive-mounted heatsink for ball grid array integrated circuits.
Aluminium square heatsink with conductive foil for BGA component cooling.
Square aluminium heatsink for cooling electronic components and circuit boards.
Compact square adhesive heatsink for small integrated circuits and electronic devices.
Medium ceramic heatsink with pin fin design for cooling LEDs and power modules.
Ceramic square heatsink for LED and power module cooling with dual mounting methods.
Small ceramic heatsink for LEDs and power ICs with adhesive and screw mounting options.
Large ceramic pin-fin heatsink for LED and power module cooling.
Ceramic heatsink for cooling electronic components like chips and LEDs in industrial equipment.
Small ceramic square heatsink for electronic component cooling with dual mounting options.