Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Thermal gel pad for cooling electronic components and processors in devices.
Thermal gel pad with good heat conductivity for electronics cooling.
High-conductivity thermal gel pad for efficient electronics cooling.
Thin thermal pad for cooling electronics and processors in high-temperature environments.
Gel-based thermal pad with strong heat conductivity for electronics.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Thermal gel pad for broad electronic component cooling applications.
High-conductivity gel thermal pad for electronics cooling to +200°C.
Gel-based potting compound with thermal conductivity for electrical component protection.
Thermal gel interface for flexible heat transfer in electronic assemblies.
High-conductivity thermal interface material for LED and electronics heat dissipation.
Thin thermal pad for transferring heat between electronic components and heatsinks.
Self-adhesive thermal interface pad for reliable heat dissipation in electronics.
Gel thermal pad for heat transfer between electronic components and heatsinks.
Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Thermal interface pad for electronics and device cooling applications.
Thin thermal interface pad for cooling electronic components in industrial equipment.
Soft thermal interface sheet for gentle component mounting and heat dissipation.
Fibreglass thermal pad for small electronics components and heat dissipation.
Thin thermal pad for cooling electronic components and managing heat in devices.
Thin thermal pad for cooling electronic components between heat sources and heatsinks.
Graphite thermal pad for cooling electronics between components and heatsinks.
Self-adhesive thermal pad for cooling electronic components in industrial equipment.
Thin thermal pad for spreading heat away from electronic components and devices.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
Thin thermal pad for cooling electronic components in industrial equipment and power systems.
Ultra-thin thermal interface material for high-performance heat transfer in compact assemblies.
Ultra-thin thermal interface pad for low-profile electronic component cooling.
Soft gel thermal pad for flexible heat dissipation in electronic equipment.
Gel-based thermal pad for flexible cooling of electronic components in devices.
Silicone thermal pad for cooling electronic components in equipment and machinery.
Self-adhesive thermal pad for CPU and electronics heat management applications.
Thin graphite thermal pad transfers heat from electronics and equipment safely.
Self-adhesive thermal pad for cooling electronics and transferring heat away from components.
Thermal interface pad for electronics heat management applications.
Ultra-thin graphite thermal sheet for extreme-temperature electronics cooling applications.
Self-adhesive thermal pad for electronics cooling and heat management applications.