Thermal gel pad for broad electronic component cooling applications.

Gel thermal pad for heat transfer between electronic components and heatsinks.

Thermal gel pad for cooling electronic components and processors in devices.

Thin thermal interface pad for cooling electronic components in industrial equipment.

Thin thermal pad for cooling electronic components between heat sources and heatsinks.

Self-adhesive thermal pad for cooling electronic components up to 200°C.

Thin red thermal pad for transferring heat from electronics to heatsinks or components.

Ultra-thin thermal pad for precision cooling of small electronic components.

Gel-based thermal pad for flexible cooling of electronic components in devices.

Gel thermal pad with high heat transfer for electronic components up to +200°C.

Thin flexible thermal pad for small electronic component heat transfer and cooling.

Two-millimetre self-adhesive thermal pad for electronic component heat management.