Thin graphite thermal pad transfers heat from electronics and equipment safely.

Ultra-thin graphite thermal pad with excellent heat conductivity.

Self-adhesive graphite thermal pad for extreme heat electronics applications.

Self-adhesive graphite thermal pad for cooling electronics and heat management applications.

Ultra-thin graphite thermal pad with strong adhesive for electronics cooling.

High-performance graphite thermal pad with adhesive for extreme heat dissipation.

Self-adhesive graphite thermal pad for industrial electronics heat dissipation.

Extra-large structural through-bolt for major equipment and installations.

Steel gland plate for routing cables through electrical enclosures.

150mm shaft for Lovato switch disconnectors.

Steel front plate for Schneider Electric PrismaSeT distribution and control enclosures.

Large aluminum heatsink for dissipating heat from electronic components and devices.

Fully threaded zinc-plated steel rod for structural fastening and assembly.

Large self-adhesive thermal interface sheet for electronic component heat management.

Extra-large zinc-plated steel coach screw for major structural applications.

Heavy-duty steel bolt anchor for permanent fastening in masonry and concrete structures.

Schneider modular chassis for 64 electrical components in enclosure installations.

Thin thermal pad for heat transfer between components in electronic devices.

Medium rectangular aluminium heatsink for general purpose electronic component cooling.

Large zinc-plated anchor bolt for heavy-duty structural fixing in concrete and masonry.

Clip-mounted rectangular heatsink for moderate heat dissipation in industrial electronics.

Medium aluminum heatsink for general industrial electronic equipment cooling.

Large flat aluminum PCB heatsink for high-power semiconductor and optoelectronic cooling.

Industrial-grade aluminum heatsink for medium to high-power thermal dissipation.

Copper heat pipe for transferring heat away from electronic devices efficiently.

PCB-mounted aluminum heatsink for cooling high-power semiconductor and optoelectronic devices.

Graphite thermal pad for cooling electronics between components and heatsinks.

Adhesive thermal pad for electronics cooling and component mounting.

Silicone thermal sheet for heat transfer between electronic components.

Copper heat pipe for cooling electronic components in industrial equipment.

Thermal gel pad for cooling electronic components and processors in devices.

Sticky thermal pad for mounting on electronic components to remove heat.

Self-stick thermal pad for heat management between electronic components.

Self-adhesive thermal pad for cooling electronics components in devices.