Adhesive-mount aluminum heatsink for BGA and semiconductor devices.
Large aluminum heatsink for high-power electronics cooling and thermal management.
Universal aluminium heatsink efficiently cools medium-power electronic devices.
Universal aluminum rectangular heatsink for electronics thermal dissipation.
Small adhesive-backed aluminium heatsink for semiconductor thermal management.
Large high-performance aluminum heatsink for heavy-duty power dissipation.
Universal aluminium heatsink dissipates heat from electronic power components.
Passive rectangular heatsink for general-purpose industrial heat dissipation applications.
Small aluminum heatsink with adhesive for chip cooling.
Medium aluminum heatsink for general industrial electronic equipment cooling.
Medium aluminum heatsink for general semiconductor cooling.
Medium aluminium heatsink for general electronic component thermal cooling.
Tiny aluminum heatsink for cooling small integrated circuits and chips.
Medium-sized aluminium heatsink for general semiconductor and power device cooling.
Large aluminum heatsink for high-power industrial applications.
Aluminum rectangular heatsink for cooling high-power electronic components in equipment.
Large universal aluminum heatsink with very low thermal resistance of 0.32K/W.
Small aluminum heatsink for cooling electronic chips and components in devices.
Aluminum heatsink for cooling electronic components and processors in industrial equipment.
Large PCB-mounted aluminium heatsink for high-power semiconductor devices.
Large aluminum heatsink for dissipating heat from electronic components and devices.
Tiny aluminum heatsink for DIL-IC integrated circuits in compact applications.
Small aluminum heatsink for electronic components using adhesive mounting.
Small universal aluminum heatsink for DIL-IC and integrated circuit packages.
Medium-size universal aluminum heatsink with excellent 2.5K/W thermal performance.
Compact aluminum heatsink for cooling small to medium electronic components.
Large universal aluminum heatsink for dissipating heat from power electronics.
Large industrial aluminum heatsink for high-power electronics and thermal management systems.
Large rectangular aluminum heatsink for universal high-power electronic cooling applications.
Rectangular aluminum heatsink with screw mounting for general-purpose power device cooling applications.
Medium aluminum heatsink for power device cooling applications.
Large aluminum heatsink for cooling power electronics and industrial equipment.
Thin flat aluminum heatsink for small integrated circuit packages and tight spaces.
Large rectangular aluminium heatsink for efficient cooling of industrial power equipment.
Rectangular aluminum heatsink for standard electronic component heat dissipation.
Rectangular aluminium heatsink for industrial heat dissipation in electronics systems.
Large clamped aluminium heatsink for high-power semiconductor cooling.
Adhesive-backed aluminum heatsink for direct chip mounting.
Large aluminum universal heatsink for high-power industrial equipment cooling.
Large aluminum rectangular heatsink for industrial power applications.