Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.

Standard self-adhesive thermal pad for straightforward electronics heat management.

Thin self-adhesive thermal sheet for bonding and heat management in small electronics.

Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.

Silicone thermal sheet for heat transfer between electronic components.

Self-adhesive thermal sheet for heat dissipation in compact electronic devices.

Fibreglass thermal sheet for cooling electronic devices at high temperatures.

One-millimetre self-adhesive thermal interface for electronics cooling applications.

Thermal gel pad with good heat conductivity for electronics cooling.

Silicone thermal pad for electronics heat transfer, 150x150mm sheet.

Non-silicone thermal pad with high heat conductivity for electronics.

Self-adhesive soft thermal pad for medium-thickness heat dissipation.

Self-adhesive thermal pad for cooling electronic components and processors.

High-conductivity self-adhesive thermal pad for efficient heat transfer.

Self-adhesive silicone thermal pad for large-area industrial equipment cooling.

Flexible silicone thermal pad fills gaps and conducts heat between surfaces.

Thin cutting disc for fast metal cutting with quick-change interface system.