Top Match
Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-122
Thin thermal pad with adhesive for standard electronics cooling needs.
Thickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Bergquist
Bergquist Self-Adhesive Thermal Interface Sheet, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P, 11 x 12in
Part: HF650P-0.001-01-1112-NA
Ultra-thin flexible thermal pad for low-profile electronics cooling systems.
11 x 12in
0.001in
11in
Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-54
Ultra-thin flexible thermal pad for compact electronic components.
0.001in
1.5W/m·K
Hi-Flow 650P
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