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Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-122
Thin thermal pad with adhesive for standard electronics cooling needs.
Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-54
Ultra-thin flexible thermal pad for compact electronic components.
Bergquist
Bergquist Self-Adhesive Thermal Interface Sheet, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P, 11 x 12in
Part: HF650P-0.001-01-1112-NA
Ultra-thin flexible thermal pad for low-profile electronics cooling systems.