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Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-54
Ultra-thin flexible thermal pad for compact electronic components.
Thickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
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