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Bergquist
Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm
Part: SPK10-0.006-00-104
Small thermal interface pad for individual electronic component cooling.
Dimensions
25.4 x 19.05mm
Thickness
0.152mm
Length
25.4mm
Bergquist
Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 25.4 x 19.05mm
Part: SP2000-0.015-00-104
Thin thermal pad for cooling electronic components in industrial equipment and power systems.
25.4 x 19.05mm
0.015in
25.4mm
Fischer Elektronik
Heatsink, 8.2K/W, 25.4 x 45 x 12.7mm, Clip
Part: SK409-25,4STC
Small clip-mounted heatsink for cooling compact power semiconductor components.
25.4mm
45mm
12.7mm
Arcol Ohmite
Heatsink, TO-218, TO-220, TO-247, 25.4 x 41.6 x 25mm, Vertical
Part: FA-T220-25E
Heatsink for multiple power component types mounted vertically.
TO-218, TO-220, TO-247
25.4mm
41.6mm
Fischer Elektronik
Heatsink, 6.5K/W, 25.4 x 42 x 25mm, Clip
Part: SK129-25,4-STS-220
Stainless steel clip-mount heatsink for electronics thermal management.
25.4mm
42mm
25mm
Schaffner
Heatsink, 12K/W, 25.4 x 29 x 12mm, Clip
Part: KL224-25.4SW
Compact clip-mounted heatsink designed for moderate heat dissipation in space-constrained applications.
25.4mm
29mm
12mm
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