Silicone damping pad for light components with exceptional temperature tolerance.
Ultra-thin thermal interface pad for low-profile electronic component cooling.
Large self-adhesive thermal interface sheet for electronic component heat management.
Thin thermal pad for heat transfer between components in electronic devices.
Self-adhesive thermal interface pad for electronics heat management and component cooling.
Translucent silicone sealant for protecting electronics from moisture and corrosion.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Self-adhesive thermal interface pad for electronics cooling with improved heat transfer capacity.
Compact FKM O-ring for temperature-resistant sealing in small equipment.
Compact FKM O-ring for high-temperature sealing in small industrial devices.
Soft sticky thermal pad for low-pressure electronics heat management.
Translucent silicone sealant for protecting electronic circuits and connectors from moisture.
Soft thermal interface pad for electronics, self-adhesive with low conductivity.
Thick soft thermal pad for industrial equipment heat dissipation.
Silicone thermal sheet for heat transfer between electronic components.
Silicone thermal grease for heat transfer between components in electronics.
Adhesive thermal pad for electronics cooling and component mounting.
Compressible thermal pad for filling gaps between components and heatsinks.
FKM O-ring for sealing cylinders and hydraulic components.
Heat-conductive liquid adhesive for bonding electronics and industrial components.
Sticky thermal pad for filling gaps between components, pre-glued.
Thick adhesive silicone thermal pad for filling gaps between components.
Sticky thermal pad for mounting on electronic components to remove heat.
Small fiberglass thermal pad for precise electronic component cooling.
Silicone thermal grease for spreading heat between electronic components and heatsinks.
Standard rubber seal ring for industrial pumps and engine components.
Compact FKM O-Ring for precision pneumatic and hydraulic components.
Thin fiberglass thermal pad for electronic component heat management.
Thermal gel pad for broad electronic component cooling applications.
Self-stick thermal pad for heat management between electronic components.
Self-adhesive thermal pad for easy installation on electronic components.
Thermal gel pad for cooling electronic components and processors in devices.
Self-adhesive thermal pad for cooling electronics components in devices.
Gel thermal pad for heat transfer between electronic components and heatsinks.