Thin graphite thermal pad transfers heat from electronics and equipment safely.
Ultra-thin high-conductivity graphite pad for advanced electronics cooling.
Ultra-thin graphite thermal pad with strong adhesive for electronics cooling.
Self-adhesive graphite thermal pad for extreme heat electronics applications.
Self-adhesive graphite thermal pad for industrial electronics heat dissipation.
High-performance graphite thermal pad with adhesive for extreme heat dissipation.
Self-adhesive graphite thermal pad for cooling electronics and heat management applications.
Steel front plate for Schneider Electric PrismaSeT distribution and control enclosures.
150mm shaft for Lovato switch disconnectors.
Steel gland plate for routing cables through electrical enclosures.
Large aluminum heatsink for dissipating heat from electronic components and devices.
Large self-adhesive thermal interface sheet for electronic component heat management.
Thin thermal pad for heat transfer between components in electronic devices.
Schneider modular chassis for 64 electrical components in enclosure installations.
Medium rectangular aluminium heatsink for general purpose electronic component cooling.
Medium aluminum heatsink for general industrial electronic equipment cooling.
Clip-mounted rectangular heatsink for moderate heat dissipation in industrial electronics.
Large flat aluminum PCB heatsink for high-power semiconductor and optoelectronic cooling.
Industrial-grade aluminum heatsink for medium to high-power thermal dissipation.
Copper heat pipe for transferring heat away from electronic devices efficiently.
PCB-mounted aluminum heatsink for cooling high-power semiconductor and optoelectronic devices.
Graphite thermal pad for cooling electronics between components and heatsinks.
Silicone thermal sheet for heat transfer between electronic components.
Adhesive thermal pad for electronics cooling and component mounting.
Copper heat pipe for cooling electronic components in industrial equipment.
Sticky thermal pad for mounting on electronic components to remove heat.
Non-silicone thermal sheet for electronic component heat dissipation.
Self-adhesive thermal pad for easy installation on electronic components.
Self-stick thermal pad for heat management between electronic components.
Thermal gel pad for broad electronic component cooling applications.
Gel thermal pad for heat transfer between electronic components and heatsinks.
Self-adhesive thermal pad for cooling electronic components and processors.
Self-adhesive thermal pad for cooling electronics components in devices.
Sticky thermal pad with built-in adhesive for easy component mounting.