Bergquist Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 19.05 x 12.7mm Part: SP2000-0.015-00-054

Fibreglass thermal interface pad for small electronics cooling applications.

Bergquist Bergquist Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 19.05 x 12.7mm Part: SP400-0.007-00-54

Fiberglass thermal pad for moderate heat dissipation in electronics.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 19.05 x 12.7mm Part: QII-0.006-00-54

Thin thermal pad transfers heat from electronics to heatsinks efficiently.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK10-0.006-00-54

Thin polyimide thermal pad for heat transfer in compact electronics.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 19.05 x 12.7mm Part: QII-0.006-AC-54

Self-adhesive Q-Pad thermal pad for efficient electronics heat transfer.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 19.05 x 12.7mm Part: SP400-0.007-AC-54

Self-adhesive thermal pad for easy electronics cooling installation.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK4-0.006-00-54

Thin polyimide thermal pad for precise heat management in small devices.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK4-0.006-AC-54

Self-adhesive polyimide thermal pad for precision electronics cooling.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK6-0.006-00-54

Small thermal interface pad for cooling components in compact electronic devices.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK10-0.006-AC-54

Thin polyimide thermal pad for semiconductor and small electronics applications.