Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 11.1 x 7.92mm Part: QII-0.006-00-50

Thin thermal pad for cooling electronics and processors in high-temperature environments.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 19.05 x 12.7mm Part: QII-0.006-00-54

Thin thermal pad transfers heat from electronics to heatsinks efficiently.

Bergquist Bergquist Thermal Interface Sheet, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 12 x 12in Part: QII-0.006-00-1212

Thin flexible thermal pad for gentle heat transfer in sensitive electronic applications.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 19.05 x 12.7mm Part: QII-0.006-AC-54

Self-adhesive Q-Pad thermal pad for efficient electronics heat transfer.

Bergquist Bergquist Self-Adhesive Thermal Interface Sheet, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 12 x 12in Part: QII-0.006-AC-1212

Self-adhesive thermal interface sheet for general electronics cooling and heat transfer.