Flexible potting compound for electrical insulation and component encapsulation.
Reenterable plastic potting compound for electronics with high dielectric strength.
Orange potting compound for sealing and protecting electrical components up to 90°C.
Flexible reenterable potting compound for electrical encapsulation and repairs.
Small transparent flexible potting compound for electrical component encapsulation.
Transparent gel potting compound for electronics protection in compact size.
Pre-mixed grey potting resin for quick electronics encapsulation.
Raytech potting compound for thermal protection of electrical components.
Heat-resistant potting compound for sealing and protecting electrical components and joints.
Potting compound for encapsulating and protecting electronic components and circuits.
Potting compound for protecting electrical assemblies from moisture and environmental damage.
Gel-form potting compound for thermal protection to 90 degrees Celsius.
Grey potting compound for protecting electrical components and circuits from moisture and damage.
Nano potting compound protects electronics from moisture and temperature extremes.
Grey Raytech potting compound for thermal management in electrical applications.
Large-volume re-enterable epoxy potting for electrical equipment and component encapsulation.
Grey potting compound for sealing and protecting electronic components up to 90°C.
Blue potting compound for electrical protection to 90 degrees maximum.
Black flame-retardant epoxy potting compound for electronics with thermal conductivity.
Transparent gel potting compound for electronic component encapsulation and protection.
Nano-formulated compound protects electronics from moisture and heat damage.
Flexible potting compound for underground and buried electrical installations.
Transparent epoxy potting compound for electronics encapsulation and protection.
Black epoxy potting compound with water resistance for electronics and thermal applications.
Flexible potting compound for protecting and insulating electrical components.
Chemical-resistant potting compound for protecting and sealing electronic components and circuits.
Modified amine potting compound offering chemical resistance for electronics protection.
Transparent gel potting compound for electronics moisture and dust protection.
Potting compound for electrical insulation and component protection.
Nano potting compound for protecting and encapsulating electronic components.
Potting compound for protecting electrical and electronic components from environmental damage.
Thermal potting compound for protecting and insulating electronic components and assemblies.
Electrical potting compound for protecting and sealing electronic components in devices.
Potting compound in blister form for encapsulating and protecting electrical components.
Resin-based potting compound protects electronics and components from moisture and heat.
Black epoxy potting compound for protecting and sealing electronic components and circuits.
Black epoxy potting compound for protecting and insulating electronic components and circuit boards.
Epoxy potting compound for protecting and sealing electronic components from moisture and damage.
Fast-setting rubber compound for protecting electronic components from moisture and damage.
Yellow potting compound for encapsulating and protecting electrical components and assemblies.