Heating element for Antex Soldip Max wave soldering pot.
Small transparent flexible potting compound for electrical component encapsulation.
Reenterable plastic potting compound for electronics with high dielectric strength.
Transparent silicone potting compound with low flammability and thermal properties.
Flexible reenterable potting compound for electrical encapsulation and repairs.
Pre-mixed grey potting resin for quick electronics encapsulation.
Black PUR potting compound with oxidation resistance for electronics protection.
Green silicone potting gel for electronics with excellent thermal and electrical properties.
Transparent gel potting compound in pack for thermal electrical applications.
Blue reenterable PUR potting compound for thermal management in electronics.
Transparent epoxy potting compound for electronics protection and encapsulation.
Large deep pot magnet with 8kg pulling force for heavy industrial holding.
Chemical and salt-water resistant epoxy potting for harsh outdoor environments.
Heated pot for bulk solder melting integrated with soldering station equipment.
Small deep pot magnet with 1.8kg pulling force for industrial holding.
Small transparent gel potting in blister pack for thermal component protection.
Thermally conductive silicone potting for high-temperature electronics protection.
Transparent gel potting compound for electronics protection in compact size.
Flame-retardant polyurethane potting compound for electrical component protection.
Large-volume re-enterable epoxy potting for electrical equipment and component encapsulation.
Strong steel pot magnet with 8kg pull force for securing metal parts and tools.
Small deep pot magnet with 1.5kg holding force for industrial assembly and fastening applications.
Raytech potting compound for thermal protection of electrical components.
Gel-form potting compound for thermal protection to 90 degrees Celsius.
Flexible potting compound for electrical insulation and component encapsulation.
Nano potting compound protects electronics from moisture and temperature extremes.
Grey Raytech potting compound for thermal management in electrical applications.
Blue potting compound for electrical protection to 90 degrees maximum.
Grey potting compound for sealing and protecting electronic components up to 90°C.
Heated pot for melting and dispensing solder during wave soldering operations.
Steel-housed pot magnet with protective casing for workshop and industrial use.
Orange potting compound for sealing and protecting electrical components up to 90°C.
Translucent epoxy potting compound resistant to harsh chemicals and moisture.
Black polyurethane potting compound for flexible protection of electronic assemblies.
Transparent gel potting compound for electronic component encapsulation and protection.
Small pack black epoxy potting compound for electronics encapsulation.
Black flame-retardant epoxy potting compound for electronics with thermal conductivity.
Black polyamide potting stick for rapid encapsulation of electronic components.
Large 1-kilogram black epoxy potting compound for industrial electrical encapsulation.
Black flexible epoxy compound for potting and protecting electronic components safely.