Black polyurethane potting compound for flexible protection of electronic assemblies.
Low-viscosity polyurethane resin for bonding and sealing industrial components.
Black two-part polyurethane resin for adhesive and potting applications.
Black PUR potting compound with oxidation resistance for electronics protection.
High-capacity yellow polyurethane wheel for demanding industrial applications.
Black polyurethane potting compound with thermal conductivity for electronics protection.
Flame-retardant polyurethane potting compound for electrical component protection.
Polyurethane potting compound for electronics, flame-resistant and heat-conducting.
Heating element for Antex Soldip Max wave soldering pot.
Small transparent flexible potting compound for electrical component encapsulation.
Reenterable plastic potting compound for electronics with high dielectric strength.
Transparent silicone potting compound with low flammability and thermal properties.
Flexible reenterable potting compound for electrical encapsulation and repairs.
Pre-mixed grey potting resin for quick electronics encapsulation.
Green silicone potting gel for electronics with excellent thermal and electrical properties.
Black polyurethane resin provides flexible bonding for electronics and mechanical parts.
Transparent gel potting compound in pack for thermal electrical applications.
Blue reenterable PUR potting compound for thermal management in electronics.
Transparent epoxy potting compound for electronics protection and encapsulation.
Large deep pot magnet with 8kg pulling force for heavy industrial holding.
Heated pot for bulk solder melting integrated with soldering station equipment.
Chemical and salt-water resistant epoxy potting for harsh outdoor environments.
Small deep pot magnet with 1.8kg pulling force for industrial holding.
Small transparent gel potting in blister pack for thermal component protection.
Thermally conductive silicone potting for high-temperature electronics protection.
Transparent gel potting compound for electronics protection in compact size.
Large-volume re-enterable epoxy potting for electrical equipment and component encapsulation.
Strong steel pot magnet with 8kg pull force for securing metal parts and tools.
Small deep pot magnet with 1.5kg holding force for industrial assembly and fastening applications.
Black polyurethane potting compound with thermal conductivity up to 125°C.
Raytech potting compound for thermal protection of electrical components.
Gel-form potting compound for thermal protection to 90 degrees Celsius.
Flexible potting compound for electrical insulation and component encapsulation.
Grey Raytech potting compound for thermal management in electrical applications.
Nano potting compound protects electronics from moisture and temperature extremes.
Blue potting compound for electrical protection to 90 degrees maximum.
Grey potting compound for sealing and protecting electronic components up to 90°C.
Small polyurethane mallet with 25mm diameter head for delicate work.
Flexible polyurethane coupler for connecting shafts in industrial machinery.
Heated pot for melting and dispensing solder during wave soldering operations.