Thin thermal interface sheet for flexible heat transfer in electronics.
Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Flexible silicone thermal interface sheet for uneven surfaces and component mounting.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Thermal interface sheet for electronics cooling, transfers heat between components efficiently.
Large self-adhesive thermal interface sheet for electronic component heat management.
Thick non-silicone thermal pad for general electronics cooling needs.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Thermal gel pad for cooling electronic components and processors in devices.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Graphite thermal pad for cooling electronics between components and heatsinks.
Soft silicone thermal pad for reliable heat transfer in electronics.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Graphite thermal pad with excellent heat transfer for electronics cooling.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Self-adhesive thermal pad for electronic component cooling and heat management.
Standard self-adhesive thermal pad for straightforward electronics heat management.
Adhesive thermal pad for electronics cooling and component mounting.
Thin self-adhesive thermal pad for direct component contact cooling.
Self-adhesive thermal pad for easy installation and heat management.
Self-stick thermal pad for heat management between electronic components.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Fibreglass thermal pad for cooling electronics between -55°C and +200°C.
Soft compressible thermal pad with adhesive for electronics heat transfer.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
High-conductivity graphite thermal sheet for demanding electronics cooling applications.
Thin self-adhesive thermal sheet for bonding and heat management in small electronics.
Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.
Medium-conductivity graphite thermal sheet for standard electronics and heat dissipation.
Silicone thermal sheet for heat transfer between electronic components.
Fibreglass thermal sheet for cooling electronic devices at high temperatures.
Red thermal pad for cooling electronic components, transfers heat away from processors and chipsets.