Ultra-thin thermal interface pad for low-profile electronic component cooling.
Self-adhesive thermal interface pad for LED and electronic component cooling.
Self-adhesive thermal interface pad for reliable heat dissipation in electronics.
Self-adhesive thermal interface sheet for filling gaps between electronic components and heat sinks.
Soft thermal interface sheet for gentle component mounting and heat dissipation.
Self-adhesive thermal pad with medium conductivity for general electronics cooling.
Self-adhesive thermal pad for cooling electronics and managing heat transfer gaps.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Self-adhesive thermal pad for cooling electronics and heat management applications.
Self-adhesive thermal interface pad for electronics cooling with improved heat transfer capacity.
Self-adhesive thermal interface pad for electronic components requiring moderate heat dissipation.
Self-adhesive thermal interface sheet for gap filling and heat dissipation in electronic devices.
Thermal interface pad for electronics cooling, fills gaps between components.
One-millimetre self-adhesive thermal interface for electronics cooling applications.
Sticky thermal interface pad for filling gaps in electronic heat management.
Self-adhesive gap pad thermal interface for flexible heat transfer in electronics.
Self-adhesive thermal interface pad for electronics heat management and component cooling.
Standard thermal gap pad for electronics heat management and cooling.
Ultra-soft thermal pad for delicate electronics, operates up to 200°C.
Self-adhesive thermal sheet for industrial electronics heat management.
Thin self-adhesive thermal pad for filling gaps in electronic equipment cooling.
Soft compressible thermal pad for filling gaps in electronics and equipment assembly.
Self-adhesive thermal pad for filling gaps and dissipating heat.
Self-adhesive thermal sheet for flexible heat dissipation, wide temperature range.
Self-adhesive thermal sheet for industrial heat management, flexible application.
Self-adhesive thermal gap pad for electronic device cooling and heat management.
Ceramic-filled thermal pad for reliable heat dissipation in electronics and semiconductor applications.
Two-millimetre self-adhesive thermal pad for electronic component heat management.
Self-adhesive gap-filling thermal pad for electronics cooling.
Thick self-adhesive thermal gap pad for industrial equipment heat dissipation.
Thick thermal spacer pad for large electronics cooling and component spacing.
Ultra-thin thermal pad for minimal gap filling and device heat management.
Sticky polymer thermal pad for general electronics cooling applications.
Ultra-soft thermal pad for electronics cooling, very compressible.
Sticky soft thermal pad for electronics, 100mm square.
Soft compressible self-adhesive thermal pad for electronics gap filling and heat transfer.
Soft sticky thermal pad for low-pressure electronics heat management.
Ultra-soft thermal pad for electronics cooling, very compressible.
Self-adhesive thermal gap filler pad for electronic component heat management.
Self-adhesive thermal pad for cooling electronic components up to 200°C.