Thick non-silicone thermal pad for general electronics cooling needs.
Red thermal pad for cooling electronic components, transfers heat away from processors and chipsets.
Thick self-adhesive thermal sheet for large surface heat dissipation.
Thicker pre-glued thermal pad for larger component heat transfer.
Large silicone thermal pad for industrial equipment heat gap filling.
High-conductivity ceramic thermal pad for extreme temperature industrial and heating applications.
Thick self-adhesive thermal pad for easy installation and heat management.
Thick adhesive thermal pad for large gap filling and heat management.
Sticky thermal pad for mounting on electronic components to remove heat.
Thicker thermal gap pad for larger spacing in electronic heat management.
Square thermal pad for standard electronics heat management.