Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Large self-adhesive thermal interface sheet for electronic component heat management.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Thermal gel pad for cooling electronic components and processors in devices.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Standard self-adhesive thermal pad for straightforward electronics heat management.
Thin self-adhesive thermal sheet for bonding and heat management in small electronics.
Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.
Silicone thermal sheet for heat transfer between electronic components.
Self-adhesive thermal sheet for heat dissipation in compact electronic devices.
Fibreglass thermal sheet for cooling electronic devices at high temperatures.
One-millimetre self-adhesive thermal interface for electronics cooling applications.
Thermal gel pad with good heat conductivity for electronics cooling.
Silicone thermal pad for electronics heat transfer, 150x150mm sheet.
Non-silicone thermal pad with high heat conductivity for electronics.
Self-adhesive soft thermal pad for medium-thickness heat dissipation.
Self-adhesive thermal pad for cooling electronic components and processors.
High-conductivity self-adhesive thermal pad for efficient heat transfer.
Flexible silicone thermal pad fills gaps and conducts heat between surfaces.
Self-adhesive silicone thermal pad for large-area industrial equipment cooling.
Thin cutting disc for fast metal cutting with quick-change interface system.