High-conductivity thermal pad for direct bonding of electronics to heat sinks and chassis.
Thin thermal pad for transferring heat between electronic components and heatsinks.
Ultra-thin thermal interface pad for compact electronics and device cooling applications.
Thermal interface strip material for LED and electronics heat management.
Thin Panasonic thermal pad for compact electronics applications.
High-performance graphite thermal pad for extreme temperature electronics cooling applications.
Precision thermal pad for compact electronic device heat management.
Ultra-thin thermal pad for compact electronics cooling applications.
Small pre-cut graphite thermal pad with adhesive for compact electronics.
Graphite thermal pad for efficient heat dissipation from electronics components.
Self-adhesive thermal strip for efficient heat transfer in linear LED and electronic layouts.
Ultra-thin thermal pad for precision electronics with minimal spacing.
Small self-adhesive graphite thermal pad for compact LED and electronic device cooling.
Compact self-adhesive graphite thermal pad for small LED and electronic devices.
High-performance graphite thermal pad with adhesive backing for electronics.
High-temperature graphite thermal pad for industrial LED and power applications.
Self-adhesive graphite thermal pad for high-temperature electronics and LED applications.
Self-adhesive graphite thermal pad for LED lighting heat management.
Large-format thermal interface pad for broad electronic component cooling.