Self-adhesive thermal interface pad for LED and electronic component cooling.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Thick non-silicone thermal pad for general electronics cooling needs.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Large self-adhesive thermal pad for industrial equipment cooling and heat management.
Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.
Non-silicone thermal sheet for electronic component heat dissipation.
Non-silicone thermal sheet for moderate heat dissipation applications.
Non-silicone thermal pad for cooling electronics and processors in industrial equipment.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Self-adhesive thermal interface pad for electronic device heat dissipation and cooling.
Self-adhesive thermal interface pad for electronic components requiring moderate heat dissipation.
Self-adhesive thermal sheet for industrial electronics heat management.
Self-adhesive thermal sheet for flexible heat dissipation, wide temperature range.
Thin self-adhesive thermal pad for filling gaps in electronic equipment cooling.
Thermal gel pad for broad electronic component cooling applications.
Non-silicone thermal pad for electronics requiring silicone-free heat management.
Soft compressible self-adhesive thermal pad for electronics gap filling and heat transfer.
Sticky soft thermal pad for electronics, 100mm square.
Larger self-adhesive thermal interface pad for industrial electronics and device heat management.
Soft gel thermal pad for flexible heat dissipation in electronic equipment.
Thin self-adhesive thermal pad for cooling gaps in industrial electronic devices.
Self-adhesive thermal sheet for electronics cooling and heat dissipation.
Self-adhesive thermal pad for moderate conductivity electronic component cooling.
Thermally conductive pad for electronics cooling and heat management.
Self-adhesive silicone thermal pad for filling gaps between components and heat sinks.
Heat-conductive paste for bonding components and improving thermal contact.
Self-adhesive thermal conductive pad for managing heat in compact electronic assemblies.
Flexible silicone thermal pad fills gaps and conducts heat between surfaces.