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Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-122
Thin thermal pad with adhesive for standard electronics cooling needs.
Bergquist
Bergquist Self-Adhesive Thermal Interface Sheet, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P, 11 x 12in
Part: HF650P-0.001-01-1112-NA
Ultra-thin flexible thermal pad for low-profile electronics cooling systems.
Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Part: HF650P-0.001-01-00-54
Ultra-thin flexible thermal pad for compact electronic components.
MG Chemical
MG Chemical 8329 TFS Liquid Thermal Adhesive, 50 ml
Part: 8329TFS-50ML
Thick thermal adhesive for securing heat sinks and thermal interface applications.
MG Chemical
MG Chemical 8329 TFS Liquid Thermal Adhesive, 25 ml
Part: 8329TFS-25ML
Thermal adhesive for heat-sensitive electronics and component bonding applications.