Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm Part: SPK10-0.006-AC-104

Self-adhesive thermal pad with polyimide base for electronics heat management.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK10-0.006-00-54

Thin polyimide thermal pad for heat transfer in compact electronics.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm Part: SPK10-0.006-00-104

Small thermal interface pad for individual electronic component cooling.

Bergquist Bergquist Thermal Interface Sheet, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 12 x 12in Part: SPK10-0.006-00-1212

Thin polyimide thermal pad for semiconductor and circuit heat management.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 28.96 x 20.57mm Part: SPK10-0.006-AC-122

Thin self-adhesive polyimide thermal pad for small IC and chip cooling.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 11.1 x 7.92mm Part: SPK10-0.006-AC-50

Ultra-thin self-adhesive polyimide thermal pad for electronic device cooling.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 19.05 x 12.7mm Part: SPK10-0.006-AC-54

Thin polyimide thermal pad for semiconductor and small electronics applications.