Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Thermal interface sheet for electronics cooling, transfers heat between components efficiently.
Thick non-silicone thermal pad for general electronics cooling needs.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.
Red thermal pad for cooling electronic components, transfers heat away from processors and chipsets.
Non-silicone thermal sheet for electronic component heat dissipation.
Non-silicone thermal sheet for heat dissipation in electronics and electrical equipment.
Non-silicone thermal sheet for moderate heat dissipation applications.
Non-silicone thermal pad for cooling electronics and processors in industrial equipment.
Thick non-silicone thermal sheet for reliable heat transfer in industrial electronics.
Non-silicone thermal pad for equipment with silicone sensitivity concerns.
Non-silicone thermal pad with high heat conductivity for electronics.
Non-silicone thermal pad for electronics requiring silicone-free heat management.
Non-silicone thermal grease for cooling electronic components in temperature extremes.
Heat-conductive paste for bonding components and improving thermal contact.
Non-silicone thermal gap pad with adhesive for component cooling.