Thin thermal interface sheet for flexible heat transfer in electronics.
Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Flexible silicone thermal interface sheet for uneven surfaces and component mounting.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Thermal interface sheet for electronics cooling, transfers heat between components efficiently.
Large self-adhesive thermal interface sheet for electronic component heat management.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Thick non-silicone thermal pad for general electronics cooling needs.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Thermal gel pad for cooling electronic components and processors in devices.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Graphite thermal pad with excellent heat transfer for electronics cooling.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Soft silicone thermal pad for reliable heat transfer in electronics.
Graphite thermal pad for cooling electronics between components and heatsinks.
Standard self-adhesive thermal pad for straightforward electronics heat management.
Self-adhesive thermal pad for electronic component cooling and heat management.
Adhesive thermal pad for electronics cooling and component mounting.
Thin self-adhesive thermal pad for direct component contact cooling.
Self-stick thermal pad for heat management between electronic components.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Self-adhesive thermal pad for easy installation and heat management.
Fibreglass thermal pad for cooling electronics between -55°C and +200°C.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
Soft compressible thermal pad with adhesive for electronics heat transfer.
High-conductivity graphite thermal sheet for demanding electronics cooling applications.
Medium-conductivity graphite thermal sheet for standard electronics and heat dissipation.
Thin self-adhesive thermal sheet for bonding and heat management in small electronics.
Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.
Silicone thermal sheet for heat transfer between electronic components.
Non-silicone thermal sheet for electronic component heat dissipation.
Ultra-thin non-adhesive thermal sheet for efficient heat transfer in electronics.