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Bergquist
Bergquist Thermal Interface Pad, 0.152mm Thick, 2.5W/m·K, Q-Pad II, 11.1 x 7.92mm
Part: QII-0.006-00-50
Thin thermal pad for cooling electronics and processors in high-temperature environments.
Bergquist
Bergquist Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 11.1 x 7.92mm
Part: SP400-0.007-00-50
Fibreglass thermal pad for electronics cooling in compact spaces.
Bergquist
Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 11.1 x 7.92mm
Part: SPK10-0.006-AC-50
Ultra-thin self-adhesive polyimide thermal pad for electronic device cooling.