Self-adhesive thermal interface sheet for filling gaps between electronic components and heat sinks.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Thermal interface sheet for electronics cooling, transfers heat between components efficiently.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Self-adhesive thermal pad with medium conductivity for general electronics cooling.
Large self-adhesive thermal pad for industrial equipment cooling and heat management.
Non-silicone thermal sheet for electronic component heat dissipation.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Self-adhesive thermal interface pad for electronic device heat dissipation and cooling.
Self-adhesive thermal interface pad for electronics cooling with improved heat transfer capacity.
Non-silicone thermal pad for equipment with silicone sensitivity concerns.
Self-adhesive thermal pad for filling gaps and dissipating heat.
Soft compressible thermal pad for filling gaps in electronics and equipment assembly.
Self-adhesive thermal sheet for flexible heat dissipation, wide temperature range.
Thermal gel pad for broad electronic component cooling applications.
Sticky soft thermal pad for electronics, 100mm square.
Soft compressible self-adhesive thermal pad for electronics gap filling and heat transfer.
Larger self-adhesive thermal interface pad for industrial electronics and device heat management.
Soft gel thermal pad for flexible heat dissipation in electronic equipment.
Medium-hardness thermal pad for general industrial electronics cooling.
Self-adhesive thermal pad for moderate conductivity electronic component cooling.
Thin self-adhesive thermal pad for cooling gaps in industrial electronic devices.