Bergquist Bergquist Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 25.4 x 19.05mm Part: SP400-0.007-00-104

Fibreglass thermal pad for small electronics components and heat dissipation.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm Part: SPK10-0.006-AC-104

Self-adhesive thermal pad with polyimide base for electronics heat management.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm Part: SPK6-0.006-00-104

High-performance polyimide thermal pad for advanced electronics cooling.

Bergquist Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 25.4 x 19.05mm Part: SP2000-0.015-00-104

Thin thermal pad for cooling electronic components in industrial equipment and power systems.

Bergquist Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm Part: SPK10-0.006-00-104

Small thermal interface pad for individual electronic component cooling.

Bergquist Bergquist Self-Adhesive Thermal Interface Pad, 0.178mm Thick, 0.9W/m·K, Fibreglass, 25.4 x 19.05mm Part: SP400-0.007-AC-104

Self-adhesive fibreglass thermal pad for electronics heat management.