Silicone damping pad for light components with exceptional temperature tolerance.
Large self-adhesive thermal interface sheet for electronic component heat management.
Ultra-thin thermal interface pad for low-profile electronic component cooling.
Thin thermal pad for heat transfer between components in electronic devices.
Self-adhesive thermal interface pad for electronics heat management and component cooling.
Compact FKM O-ring for high-temperature sealing in small industrial devices.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Compact FKM O-ring for temperature-resistant sealing in small equipment.
Translucent silicone sealant for protecting electronics from moisture and corrosion.
Self-adhesive thermal interface pad for electronics cooling with improved heat transfer capacity.
Soft sticky thermal pad for low-pressure electronics heat management.
Translucent silicone sealant for protecting electronic circuits and connectors from moisture.
Soft thermal interface pad for electronics, self-adhesive with low conductivity.
Thick soft thermal pad for industrial equipment heat dissipation.
Silicone thermal grease for heat transfer between components in electronics.
FKM O-ring for sealing cylinders and hydraulic components.
Adhesive thermal pad for electronics cooling and component mounting.
Compressible thermal pad for filling gaps between components and heatsinks.
Silicone thermal sheet for heat transfer between electronic components.
Thin fiberglass thermal pad for electronic component heat management.
Heat-conductive liquid adhesive for bonding electronics and industrial components.
Thermal gel pad for broad electronic component cooling applications.
Small fiberglass thermal pad for precise electronic component cooling.
Sticky thermal pad for mounting on electronic components to remove heat.
Small FKM O-Ring for pumps, valves and hydraulic components.
Self-adhesive thermal pad for cooling electronics components in devices.
Thermal gel pad for cooling electronic components and processors in devices.
Standard rubber seal ring for industrial pumps and engine components.
Flexible thermal pad for heat transfer in electronics and display modules.
Gel thermal pad for heat transfer between electronic components and heatsinks.
Self-adhesive thermal pad for easy installation on electronic components.
Thermal interface pad for electronics cooling, fills gaps between components.
Self-adhesive thermal pad for cooling electronic components and processors.
Compact FKM O-Ring for precision pneumatic and hydraulic components.