Square aluminium heatsink for cooling electronic components and circuit boards.

Aluminum heatsink for general cooling of flat semiconductor devices.

Compact square heatsink for PGA microprocessor package thermal cooling.

High-performance aluminum heatsink with adhesive mounting for efficient thermal dissipation.

Square aluminium heatsink with adhesive foil mounting for IC thermal management.

Adhesive-mounted aluminum heatsink for integrated circuits and BGA packages.

Small square aluminium heatsink for BGA packages with conductive adhesive mounting.

Small adhesive-mounted aluminum heatsink for BGA chip cooling.

Square heatsink for processor or high-heat integrated circuits with adhesive attachment.

Tiny adhesive-mounted heatsink for ball grid array integrated circuits.

Square aluminium clip-mounted heatsink for BGA package cooling.

Self-adhesive square aluminum heatsink with conductive foil for electronics.

Square aluminium heatsink for PGA package cooling with conductive foil adhesive mounting.

Aluminium heatsink for cooling electronic components with adhesive mounting.

Aluminum heatsink for cooling electronic components in industrial equipment.

Universal square aluminium heatsink for semiconductors and electronic components.

Tiny adhesive aluminum heatsink for small electronic chips and components.

Aluminium heatsink for cooling computer processor chips and electronic components.

Small square aluminium heatsink with adhesive mounting for circuit board components.

Small square aluminium heatsink with adhesive foil for compact electronic component cooling.

Large square heatsink for LED arrays and high-power electronic component cooling.