Ultra-soft thermal pad for delicate electronics, operates up to 200°C.
Self-adhesive thermal sheet for flexible heat dissipation, wide temperature range.
Self-adhesive thermal sheet for industrial electronics heat management.
Thin self-adhesive thermal pad for filling gaps in electronic equipment cooling.
Self-adhesive thermal pad for filling gaps and dissipating heat.
Ceramic-filled thermal pad for reliable heat dissipation in electronics and semiconductor applications.
Two-millimetre self-adhesive thermal pad for electronic component heat management.
Self-adhesive gap-filling thermal pad for electronics cooling.
Self-adhesive thermal gap pad for electronic device cooling and heat management.
Thick self-adhesive thermal gap pad for industrial equipment heat dissipation.
Thick thermal spacer pad for large electronics cooling and component spacing.
Ultra-thin thermal pad for minimal gap filling and device heat management.
Sticky polymer thermal pad for general electronics cooling applications.
Soft sticky thermal pad for low-pressure electronics heat management.
Ultra-soft thermal pad for electronics cooling, very compressible.
Sticky soft thermal pad for electronics, 100mm square.
Self-adhesive thermal pad for cooling electronic components up to 200°C.
Self-adhesive thermal gap filler pad for electronic component heat management.
Omron compact safety controller module for networked industrial safety systems.
Thick soft thermal pad for industrial equipment heat dissipation.
Medium thermal interface sheet for electronics cooling applications.
Flat ribbon cable for connecting circuit boards and compact electronic devices.
Polyamide upper enclosure for DIN rail electrical control panels and distribution boxes.
Medium-hardness thermal pad for general industrial electronics cooling.
Self-adhesive polymer thermal pad for gentle cooling of sensitive electronic devices.
Self-adhesive thermal pad for moderate conductivity electronic component cooling.
Thin self-adhesive thermal pad for cooling gaps in industrial electronic devices.
Self-adhesive thermal gap filler pad for electronic equipment heat management.
Self-adhesive thermal pad for reliable heat transfer in electronic applications.
Thick thermal pad for robust electronics heat dissipation.
Square thermal pad for standard electronics heat management.
Thick thermal pad for electronics heat management and cooling applications.
Thin thermal pad for heat management in compact electronic devices.
Ultra-thin thermal pad for precise heat transfer in compact electronics.