Adhesive thermal pad for electronics cooling and component mounting.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Self-adhesive thermal pad for electronic component cooling and heat management.
Self-stick thermal pad for heat management between electronic components.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Thin self-adhesive thermal pad for direct component contact cooling.
Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Silicone thermal sheet for heat transfer between electronic components.
Non-silicone thermal sheet for electronic component heat dissipation.
Red thermal pad for cooling electronic components, transfers heat away from processors and chipsets.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Thick non-silicone thermal pad for general electronics cooling needs.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Heat transfer pad for electronics cooling, 150×150mm, operates -40 to +125°C.
Graphite thermal pad with excellent heat transfer for electronics cooling.
Soft silicone thermal pad for reliable heat transfer in electronics.
Standard self-adhesive thermal pad for straightforward electronics heat management.
Self-adhesive thermal pad for easy installation and heat management.
Fibreglass thermal pad for cooling electronics between -55°C and +200°C.
Soft compressible thermal pad with adhesive for electronics heat transfer.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
Non-silicone thermal sheet for heat transfer in low to moderate temperature electronics.
Medium-conductivity graphite thermal sheet for standard electronics and heat dissipation.
Thin self-adhesive thermal sheet for bonding and heat management in small electronics.
High-conductivity graphite thermal sheet for demanding electronics cooling applications.