Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Fibreglass thermal interface pad for small electronics cooling applications.
Flexible self-adhesive thermal pad for electronics heat dissipation and component cooling.
Self-adhesive thermal interface pad for reliable heat dissipation in electronics.
Thermal gel pad for cooling electronic components and processors in devices.
Thin thermal interface sheet for flexible heat transfer in electronics.
Adhesive thermal pad for electronics cooling and component mounting.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Self-adhesive thermal pad for electronic component cooling and heat management.
Self-stick thermal pad for heat management between electronic components.
Thin red thermal pad for transferring heat from electronics to heatsinks or components.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Thin self-adhesive thermal pad for direct component contact cooling.
Ultra-thin thermal interface sheet for precise heat transfer in compact electronics.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Silicone thermal sheet for heat transfer between electronic components.
Self-adhesive thermal interface pad for electronics heat management and component cooling.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Soft silicone thermal pad for reliable heat transfer in electronics.
Standard self-adhesive thermal pad for straightforward electronics heat management.
Self-adhesive thermal pad for easy installation and heat management.
Self-adhesive thermal pad with medium conductivity for general electronics cooling.
Large self-adhesive thermal pad for industrial equipment cooling and heat management.
Self-adhesive thermal pad for cooling electronics and managing heat transfer gaps.
Fibreglass thermal pad for cooling electronics between -55°C and +200°C.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
Soft compressible thermal pad with adhesive for electronics heat transfer.
Thin self-adhesive thermal sheet for bonding and heat management in small electronics.