Ultra-thin graphite thermal pad for high-performance industrial heat management.
Self-adhesive graphite thermal pad for industrial electronics heat dissipation.
Self-adhesive graphite thermal pad for extreme heat electronics applications.
Self-adhesive graphite thermal pad for cooling electronics and heat management applications.
Large self-adhesive thermal interface sheet for electronic component heat management.
Ultra-thin high-conductivity graphite pad for advanced electronics cooling.
Ultra-thin graphite thermal pad with strong adhesive for electronics cooling.
High-performance graphite thermal pad with adhesive for extreme heat dissipation.
Flexible silicone thermal interface sheet for uneven surfaces and component mounting.
Thermal interface sheet for electronics cooling, transfers heat between components efficiently.
Thermal gel pad for cooling electronic components and processors in devices.
Graphite thermal pad for cooling electronics between components and heatsinks.
Thin thermal interface sheet for flexible heat transfer in electronics.
Adhesive thermal pad for electronics cooling and component mounting.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Self-adhesive thermal pad for electronic component cooling and heat management.
Self-stick thermal pad for heat management between electronic components.
Thin self-adhesive thermal pad for direct component contact cooling.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Red thermal interface sheet for cooling electronics, 150x150mm, operates -40 to +105°C.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Non-silicone thermal interface pad for heat transfer in electronic device cooling.
Thick silicone thermal interface sheet for industrial electronics and heat management.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Silicone thermal sheet for heat transfer between electronic components.
Non-silicone thermal sheet for electronic component heat dissipation.
Red thermal pad for cooling electronic components, transfers heat away from processors and chipsets.
Thick non-silicone thermal pad for general electronics cooling needs.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Ultra-thin non-silicone thermal pad for tight electronic assemblies.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.