Thin thermal pad for heat transfer between components in electronic devices.
Universal rectangular aluminum heatsink for efficient electronic device cooling.
Large rectangular aluminium heatsink for efficient power dissipation cooling.
Galvanised steel crosspiece for ABB IS2 electrical enclosure systems.
Galvanised steel crosspiece for ABB IS2 electrical enclosure cabinets.
Adhesive thermal pad for electronics cooling and component mounting.
Graphite thermal pad for cooling electronics between components and heatsinks.
Tool steel flat bar for cutting and shaping into components.
Silicone thermal sheet for heat transfer between electronic components.
Self-adhesive thermal pad for easy installation on electronic components.
Self-adhesive thermal pad for cooling electronic components and processors.
Thermal gel pad for broad electronic component cooling applications.
Non-silicone thermal sheet for electronic component heat dissipation.
Sticky thermal pad for mounting on electronic components to remove heat.
Self-adhesive thermal pad for cooling electronics components in devices.
Plain metal washer for ABB TriLine electrical component assembly.
Sticky thermal pad with built-in adhesive for easy component mounting.
Thermal gel pad for cooling electronic components and processors in devices.
Gel thermal pad for heat transfer between electronic components and heatsinks.
Self-stick thermal pad for heat management between electronic components.
Gel-based thermal pad for flexible cooling of electronic components in devices.
Self-adhesive thermal pad for cooling electronics components in confined spaces.
Thick silicone thermal pad for durable cooling of electronic components in equipment.
Thermal interface sheet for electronics cooling, transfers heat between components efficiently.
Flexible silicone thermal interface sheet for uneven surfaces and component mounting.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Thin self-adhesive thermal pad for direct component contact cooling.
Thicker pre-glued thermal pad for larger component heat transfer.
Self-adhesive thermal pad for electronic component cooling and heat management.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Silicone thermal pad for cooling electronic components across wide temperature range.
Large graphite thermal pad for cooling medium-sized electronic components and devices.
Ultrasonic cleaner with 2.5-litre tank for cleaning small parts and components.
Red thermal pad for cooling electronic components, transfers heat away from processors and chipsets.