Self-adhesive thermal pad for cooling electronics and managing heat transfer gaps.
Soft thermal interface sheet for electronics, 200x100mm with Gap Pad material.
Siemens ET 200SP PLC CPU with 20 inputs and Profinet Ethernet for networked control.
Self-adhesive thermal pad for cooling electronics and heat management applications.
Self-adhesive thermal interface pad for electronic components requiring moderate heat dissipation.
Self-adhesive thermal interface pad for electronics cooling with improved heat transfer capacity.
Self-adhesive thermal interface sheet for gap filling and heat dissipation in electronic devices.
Thermal interface pad for electronics cooling, fills gaps between components.
Sticky thermal interface pad for filling gaps in electronic heat management.
One-millimetre self-adhesive thermal interface for electronics cooling applications.
Self-adhesive gap pad thermal interface for flexible heat transfer in electronics.
Self-adhesive thermal interface pad for electronics heat management and component cooling.
Standard thermal gap pad for electronics heat management and cooling.
Thin self-adhesive thermal pad for filling gaps in electronic equipment cooling.
Soft compressible thermal pad for filling gaps in electronics and equipment assembly.
Ultra-soft thermal pad for delicate electronics, operates up to 200°C.
Self-adhesive thermal sheet for industrial electronics heat management.
Self-adhesive thermal sheet for flexible heat dissipation, wide temperature range.
Self-adhesive thermal pad for filling gaps and dissipating heat.
Self-adhesive thermal sheet for industrial heat management, flexible application.
Thick self-adhesive thermal gap pad for industrial equipment heat dissipation.
Ceramic-filled thermal pad for reliable heat dissipation in electronics and semiconductor applications.
Two-millimetre self-adhesive thermal pad for electronic component heat management.
Self-adhesive thermal gap pad for electronic device cooling and heat management.
Self-adhesive gap-filling thermal pad for electronics cooling.
Thick thermal spacer pad for large electronics cooling and component spacing.
Ultra-thin thermal pad for minimal gap filling and device heat management.
Sticky polymer thermal pad for general electronics cooling applications.
Ultra-soft thermal pad for electronics cooling, very compressible.
Soft compressible self-adhesive thermal pad for electronics gap filling and heat transfer.
Sticky soft thermal pad for electronics, 100mm square.
Soft sticky thermal pad for low-pressure electronics heat management.
Ultra-soft thermal pad for electronics cooling, very compressible.
Self-adhesive thermal pad for cooling electronic components up to 200°C.