Thick silicone thermal interface sheet for industrial electronics and heat management.
Flexible silicone thermal interface sheet for uneven surfaces and component mounting.
Thin flexible silicone thermal interface sheet for compact electronics and heat management.
Large self-adhesive thermal interface sheet for electronic component heat management.
Soft thermal interface sheet for gentle component mounting and heat dissipation.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Medium-thickness self-adhesive thermal pad for electronics cooling needs.
Self-adhesive yellow thermal sheet for medium electronics heat dissipation.
Flexible self-adhesive thermal pad for electronics heat dissipation and component cooling.
Thermal gel pad for cooling electronic components and processors in devices.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
High-conductivity silicone thermal pad for efficient heat dissipation in devices.
Soft silicone thermal pad for reliable heat transfer in electronics.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Self-adhesive thermal pad for electronic component cooling and heat management.
Standard self-adhesive thermal pad for straightforward electronics heat management.
Thin self-adhesive thermal pad for direct component contact cooling.
Adhesive thermal pad for electronics cooling and component mounting.
Self-stick thermal pad for heat management between electronic components.
Self-adhesive thermal pad for cooling electronics components in industrial equipment.
Thin red thermal pad for transferring heat from electronics to heatsinks or components.
Self-adhesive thermal pad for easy installation and heat management.
Self-adhesive thermal pad with medium conductivity for general electronics cooling.
Large self-adhesive thermal pad for industrial equipment cooling and heat management.
Self-adhesive thermal pad for cooling electronics and managing heat transfer gaps.
Fibreglass thermal pad for cooling electronics between -55°C and +200°C.
Self-adhesive thermal pad for cooling electronics and heat dissipation in devices.
Thin thermal pad for cooling electronic components in industrial equipment and power systems.
Soft compressible thermal pad with adhesive for electronics heat transfer.
Thin self-adhesive thermal sheet for bonding and heat management in small electronics.
Ultra-thin thermal sheet for efficient heat transfer in compact electronic assemblies.
Silicone thermal sheet for heat transfer between electronic components.
Self-adhesive thermal sheet for heat dissipation in compact electronic devices.