Self-adhesive thermal pad for cooling electronic components up to 200°C.
Ultra-thin thermal interface pad for large electronic components and heat transfer.
Ultra-thin gel thermal pad for efficient heat transfer in electronic devices.
Thin thermal pad for small electronic devices and semiconductor heat management.
Gel-based thermal pad for reliable heat transfer in electronic assemblies.
Ultra-thin thermal interface pad for tight-fit electronics cooling.
Ultra-thin thermal interface sheet for precise heat transfer in compact electronics.
Thin thermal interface pad for cooling electronic components in industrial equipment.
Thin thermal pad for cooling electronic components between heat sources and heatsinks.
Thin thermal pad for electronics heat transfer between components.
Thermal gel pad for cooling electronic components and processors in devices.
Thin red thermal pad for transferring heat from electronics to heatsinks or components.
Gel thermal pad for cooling electronics and managing heat transfer in devices.
Self-adhesive thermal pad for electronics cooling and heat management applications.
High-conductivity gel thermal pad for electronics cooling to +200°C.
Ultra-thin thermal pad for precision cooling of small electronic components.
Gel thermal pad with high heat transfer for electronic components up to +200°C.
Small thermal interface pad for precise component-level electronic device cooling.
Thin flexible thermal pad for small electronic component heat transfer and cooling.
Self-adhesive thermal pad for reliable heat transfer in electronic applications.
Compact ultra-thin thermal pad for space-constrained electronic cooling.
A small two-position slide switch that mounts directly onto circuit boards for electrical configuration and control in industrial equipment.
Gel thermal pad for heat transfer between electronic components and heatsinks.
One-millimetre self-adhesive thermal interface for electronics cooling applications.
Ultra-thin non-adhesive thermal sheet for efficient heat transfer in electronics.
Thermal gel interface for flexible heat transfer in electronic assemblies.
Gel-based thermal pad for flexible cooling of electronic components in devices.
Soft gel thermal pad for flexible heat dissipation in electronic equipment.
Two-millimetre self-adhesive thermal pad for electronic component heat management.
Ultra-thin thermal interface pad for small electronic components and heat dissipation.
High-conductivity thermal gel pad for efficient electronics cooling.
Gel-based thermal pad with strong heat conductivity for electronics.
Thermal gel pad for broad electronic component cooling applications.
Thermal gel pad with good heat conductivity for electronics cooling.
Compact thermal pad for precise heat management in miniature electronics.
Flexible thermal pad for heat transfer in electronics and display modules.
Ultra-thin thermal pad for precision electronics with minimal spacing.
Extremely thin thermal interface sheet for tight-space electronics cooling.
Ultra-thin thermal gap pad for small electronics requiring minimal space.
Ultra-thin thermal sheet for efficient heat transfer in compact electronic assemblies.