Self-adhesive silicone thermal pad for filling gaps and transferring heat in electronics.

Portable pressure calibrator for testing and verifying pressure instruments up to 2 bar.

Thin self-adhesive thermal pad for LED and electronics heat transfer applications.

Ready-made coaxial cable with right-angle connectors for RF and telecommunications applications.

Portable pressure calibrator for testing gauges and sensors, ATEX certified.

Aluminum rectangular heatsink for cooling high-power electronic components in equipment.

Thin self-adhesive silicone thermal pad for electronics cooling and heat dissipation.

Large self-adhesive silicone thermal pad with high conductivity for electronics cooling.

Thermal interface strip material for LED and electronics heat management.

Ultra-thin thermal interface pad for precise heat transfer in electronics.

Self-adhesive silicone pad for filling thermal gaps in large electronic assemblies.

Terminated RF coaxial cable with right-angle connectors for wireless equipment.

Thin copper sheet for electrical, thermal and decorative applications.

Copper heat pipe for transferring heat in electronic and thermal systems.

Copper heat pipe for efficient passive thermal distribution in electronics.

Self-adhesive silicone thermal pad for filling gaps in electronic assemblies.

Short RF coaxial cable with MCX connector for wireless and test equipment.

Thick self-adhesive silicone pad for gaps and heat transfer in electronics.

Ultra-thin large-area thermal pad for broad electronic component coverage.

Large self-adhesive silicone thermal pad for heat management in industrial electronics.

Compact MMCX-terminated RF cable for small wireless devices and test equipment.

Short RF coaxial cable with SMA connectors for wireless and test equipment connections.

Adapter converting USB power to 3.5mm DC jack for small electronics.

Self-adhesive thermal strip for efficient heat transfer in linear LED and electronic layouts.

Self-adhesive silicone thermal pad for electronic device cooling and heat gap filling.